Soon M. Chung, Wright State University, USA
Gajendra Sharma, Kathmandu University, Nepal

Advisory Chair

Dimitrios A. Karras, National and Kapodistrian University of Athens, Greece

Publicity Chairs

Lianne Lam, Hong Kong Polytechnic University, China
HO To Sum, George, The Hang Seng University of Hong Kong, China
Rushit Dave, Minnesota State University, USA
Man Fung LO, The University of Hong Kong, China  (IEEE senior member)

Chapter Chairr

Xin Lu, Leeds Trinity University, UK   (IEEE  member)

Technical Committee Chairs

C. H. Wu, The Hang Seng University of Hong Kong, China   (IEEE  member)
Yepeng Ni, Communication University of China, China
Grigorios N. Beligiannis, University of Patras, Greece
Meng Su, The Pennsylvania State University, USA 

Technical Program Committees

Yong Shi, Kennesaw State University, USA
Lee Chien Sing, Sunway University, Malaysia (IEEE senior member)
Addisson Salazar, Universitat Politècnica de València, Spain
Janusz Kacprzyk, Systems Research Institute, Polish Academy of Sciences, Poland (IEEE Life Fellow)
Qiang Cheng, Stanley and Karen Pigman College of Engineering, USA
Teoh Ai Ping, Universiti Sains Malaysia, Malaysia
Bo Mei, Texas Christian University, USA
Alex Mathew, Bethany College, USA (IEEE  member)
Seppo Sirkemaa, University of Turku, Finland
Witold Pedrycz, University of Alberta, Canada (IEEE Fellow)
Sinan Chen, Kobe University, Japan (IEEE  member)
Mahesh Chaudhari, University of San Francisco, USA
Xin Lu, Leeds Trinity University, UK (IEEE  member)
Gyu Myoung Lee, Liverpool John Moores University, UK (IEEE  member)
Antonio Sarasa, Cabezulo Universidad Complutense de Madrid, Spain
Woo Chaw Seng, University of Malaya, Malaysia  (IEEE  member)
Yihan Wang, University of Pennsylvania, USA
Marcin Paprzycki, Polish Academy of Sciences, Poland (IEEE senior member)
Dariusz Jakobczak, Koszalin University of Technology, Poland
Kebin Peng, East Carolina University, USA
Aziz Fellah, Northwest Missouri State University, USA
Karthik Kushala, Taylor Corporation, North Mankato, USA
Priyadarshini Radhakrishnan, IBM Corporation, USA
Venkata Ramesh Induru, Piorion Solutions Inc, USA
Vijai Anand Ramar, Delta Dental Insurance Company, USA
Yashwant Kumar Kolli, Cognizant Technology Solutions US Corp, USA
Weiwei Jiang, Beijing University of Posts and Telecommunications, China  (IEEE  member)
Basim Alhadidi, Al-Balqa Applied University, Jordan
Qiuyu Zhu, Shanghai University, China   (IEEE  member)
Paulo Batista, University of Évora, Portugal
Mingyuan Jiu, Zhengzhou University, China  (IEEE  member)
Grienggrai Rajchakit, Maejo University, Thailand